The behavior of the crystal depends on the preset angle at which the crystal bar is cut into wafers to a great extent. The most popular cutting method is AT-Cut. With the same frequency, the BT-Cut results in thicker cutting than the AT-Cut. Therefore, the cutting of the wafer with higher frequency can be carried out by the BT-Cut.

One of main differences between the AT-Cut and the BT-Cut is the varied frequency stability. Please refer to the temperature coefficient curves of the two cutting methods.